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s eptember 20 13 r e v 4 1/25 25 vnd10n06 vnd10n06-1 "omnifet" fully autoprotected power mosfet features linear current limitation thermal shutdown short circuit protection integrated clamp low current drawn from input pin logic level input threshold esd protection schmitt trigger on input high noise immunity description the vnd10n06 and vnd10n06-1 are monolithic devices designed in stmicroelectronics vipower m0-2 technology, intended for replacement of standard power mosfets in dc to 50khz applications. built in thermal shutdown, linear current limitation and overvoltage clamp protect the chip in harsh environments. max on-state resist ance (per ch.) r ds(on) 0.3 ? current limitation (typ) i lim 10a drain-source clamp voltage v clamp 60v 1 3 3 2 1 dpak to-252 ipak to-251 table 1. device summary package order codes tube tape and reel dpak vnd10n06 vnd10n06tr ipak vnd10n06-1 www.st.com
contents vnd10n06 / vnd10n06-1 2/25 contents 1 block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.4 electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3 protection features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5 package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1 ecopack ? packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.2 dpak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.3 ipak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.4 dpak packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 5.5 ipak packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
vnd10n06 / vnd10n06-1 list of tables 3/25 list of tables table 1. device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 table 2. absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 3. thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 table 4. off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 5. switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 6. on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 table 7. dynamic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 8. source drain diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 9. protections (-40c < tj < 150c, unless otherwise specified) . . . . . . . . . . . . . . . . . . . . . . . 8 table 10. dpak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 11. ipak mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 12. document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
list of figures vnd10n06 / vnd10n06-1 4/25 list of figures figure 1. block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 figure 2. switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3. switching time test circuit for resistive load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 4. test circuit for inductive load switching and diode recovery time . . . . . . . . . . . . . . . . . . . . . 9 figure 5. unclamped inductive load test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 6. input charge test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 figure 7. unclamped inductive waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 8. static drain-source on resistance (v in = 3.5v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 9. static drain-source on resistance (v in = 5v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 10. derating curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 11. static drain-source on resistance vs. input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 12. current limit vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 13. source-drain diode voltage vs. junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 14. step response current limit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 15. switching time resistive load. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 16. turn-on current slope (v in = 3.5v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 17. turn-on current slope (v in = 7v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 18. input voltage vs. input charge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 19. turn-off drain-source voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 20. turn-off drain-source voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 21. capacitance variations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 22. switching time resistive load. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 23. normalized on resistance vs. temperature (v in = 7v) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 24. output characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 25. normalized on resistance vs. temperature (v in = 3.5v). . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 26. normalized input threshold voltage vs. temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 27. thermal impedance fo r dpak / ipak . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 28. dpak package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 29. ipak mechanical data an d package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 figure 30. dpak footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 31. dpak tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 figure 32. dpak tape and reel sh ipment (suffix ?tr?) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 figure 33. ipak tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
vnd10n06 / vnd10n06-1 block diagram and pin description 5/25 1 block diagram and pin description figure 1. block diagram
electrical specifications vnd10n06 / vnd10n06-1 6/25 2 electrical specifications 2.1 absolute maximum ratings stressing the device above the rating listed in the ?absolute maximum ratings? table may cause permanent damage to the device. these are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not imp lied. exposure to absolute ma ximum rating conditions for extended periods may affect device reliability. refer also to the stmicroelectronics sure program and other relevant quality document. 2.2 thermal data table 2. absolute maximum ratings symbol parameter value unit v dsn drain-source voltage (v in = 0v) internally clamped v v inn input voltage internally clamped v i in input current 20 ma i dn drain current internally limited a i rn reverse dc output current - 15 a v esd electrostatic discharge (r = 1.5k , c = 100pf) 4000 v p tot total dissipation at t c = 25c 35 w t j operating junction temperature internally limited c t c case operating temperature internally limited c t stg storage temperature - 55 to 150 c table 3. thermal data symbol parameter max. value unit r thj-case thermal resistance junction-case 3.5 c/w r thj-amb thermal resistance junction-ambient 100 c/w
vnd10n06 / vnd10n06-1 electrical specifications 7/25 2.3 electrical characteristics t case = 25 c unless otherwise stated. table 4. off symbol parameter test conditions min. typ. max. unit v clamp drain-source clamp voltage v in = 0v; i d = 200ma 50 60 70 v v il input low level voltage i d = 100 a; v ds = 16 v 1.5 v v ih input high level voltage r l = 27 ; v dd = 16 v v ds = 0.5 v 3.2 v i iss supply current from input pin v ds = 0v; v in = 5v 150 300 a v incl input-source reverse clamp voltage i in = -1ma i in = 1ma -1 8 -0.3 11 v v i dss zero input voltage drain current (v in = 0v) v ds = 50v; v in = v il ; v ds < 35v; v in = v il 250 100 a a table 5. switching (1) 1. parameters guaranteed by design / characterization. symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time v dd = 16v; i d = 1a v gen = 7v; r gen = 10 (see figure 2 ) 1100 1600 ns t r rise time 550 900 ns t d(off) turn-off delay time 200 400 ns t f fall time 100 200 ns t d(on) turn-on delay time v dd = 16v; i d = 1a v gen = 7v; r gen = 1000 (see figure 2 ) 1.2 1.8 s t r rise time 1 1.5 s t d(off) turn-off delay time 1.6 2.3 s t f fall time 1.2 1.8 s (di/dt) on turn-on current slope v dd = 16v; i d = 1a v in = 7v; r gen = 10 1.5 a/s q i total input charge v dd = 12v; i d = 1a; v in = 7v 13 nc table 6. on (1) 1. pulsed: pulse duration = 300s, duty cycle 1.5%. symbol parameter test conditions min. typ. max. unit r ds(on) static drain-source on resistance v in = 7v; i d = 1 a; t j < 125 c 0.15 0.3
electrical specifications vnd10n06 / vnd10n06-1 8/25 figure 2. switching waveforms table 7. dynamic symbol parameter test conditions min. typ. max. unit c oss output capacitance v ds = 13v; f = 1mhz; v in = 0v 350 500 pf table 8. source drain diode symbol parameter test conditions min. typ. max. unit v sd (1) 1. pulsed: pulse duration = 300s, duty cycle 1.5%. forward on voltage i sd = 1 a; v in = v il 0.8 1.6 v t rr (2) 2. parameters guaranteed by design / characterization. reverse recovery time i sd = 1a; di/dt = 100 a/s v dd = 30v; t j = 25c (see figure 4 ) 125 ns q rr (2) reverse recovery charge 0.22 c i rrm (2) re verse recovery current 3.5 a table 9. protections (-40c < t j < 150c, unless otherwise specified) symbol parameter test conditions min. typ. max. unit i lim drain current limit v in = 7v; v ds =13v 6 10 15 a t dlim (1) 1. parameters guaranteed by design / characterization. step response current limit v in = 7 v; v ds step from 0 to 13v 12 20 s t jsh (1) overtemperature shutdown 150 c t jrs (1) overtemperature reset 135 c e as (1) single pulse avalanche energy starting t j = 25c; v dd = 24v v in = 7v r gen = 1k ?; l = 10mh 250 mj
vnd10n06 / vnd10n06-1 electrical specifications 9/25 figure 3. switching time test circuit for resistive load figure 4. test circuit for inductive load switching and diode recovery time
electrical specifications vnd10n06 / vnd10n06-1 10/25 figure 5. unclamped inductive load test circuits figure 6. input charge test circuit r gen p w v in gen nd8003 v in
vnd10n06 / vnd10n06-1 electrical specifications 11/25 figure 7. unclamped inductive waveforms
electrical specifications vnd10n06 / vnd10n06-1 12/25 2.4 electrical characteristics curves figure 8. static drain-source on resistance (v in = 3.5v) figure 9. static drain-source on resistance (v in = 5v) figure 10. derating curve figure 11. static drain-source on resistance vs. input voltage figure 12. current limit vs. junction temperature figure 13. source-drain diode voltage vs. junction temperature
vnd10n06 / vnd10n06-1 electrical specifications 13/25 figure 14. step response current limit fi gure 15. switching time resistive load figure 16. turn-on current slope (v in = 3.5v) figure 17. turn-on current slope (v in = 7v) figure 18. input voltage vs. input charge figure 19. turn-off drain-source voltage slope
electrical specifications vnd10n06 / vnd10n06-1 14/25 figure 20. turn-off drain-source voltage slope figure 21. capacitance variations figure 22. switching time resistive load figure 23. normalized on resistance vs. temperature (v in = 7v) figure 24. output characteristics figure 25. normalized on resistance vs. temperature (v in = 3.5v)
vnd10n06 / vnd10n06-1 electrical specifications 15/25 figure 26. normalized input threshold voltage vs. temperature
protection features vnd10n06 / vnd10n06-1 16/25 3 protection features during normal operation, the input pin is elec trically connected to the gate of the internal power mosfet through a low impedance path as soon as v in > v ih . the device then behaves like a standard power mosfet and can be used as a switch from dc to 50khz. the only difference from the user?s standpoint is that a small dc current i iss flows into the input pin in order to supply the internal circuitry. during turn-off of an unclamped inductive load the output voltage is clamped to a safe level by an integrated zener clamp between drain pin and the gate of the internal power mosfet. in this condition, the power mosfet gate is set to a voltage high enough to sustain the inductive load current even if the input pin is driven to 0v. the device integrates an active current limiter circuit which limits the drain current id to ilim whatever the input pin voltage. when the current limiter is active, the device operates in the linear region, so power dissipation may exceed the he atsinking capability. both ca se and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold t jsh . if t j reaches t jsh , the device shuts down whatever th e input pin voltage. the device will restart automatically when t j has cooled down to t jrs .
vnd10n06 / vnd10n06-1 thermal data 17/25 4 thermal data figure 27. thermal impedance for dpak / ipak
package and packing information vnd10n06 / vnd10n06-1 18/25 5 package and packing information 5.1 ecopack ? packages in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com. ecopack ? is an st trademark. 5.2 dpak mechanical data figure 28. dpak package dimensions p032p
vnd10n06 / vnd10n06-1 package and packing information 19/25 table 10. dpak mechanical data dim. millimeters min. typ. max. a 2.20 2.40 a1 0.90 1.10 a2 0.03 0.23 b 0.64 0.90 b2 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 d 6.00 6.20 d1 5.1 e 6.40 6.60 e1 4.7 e2.28 g 4.40 4.60 h 9.35 10.10 l2 0.8 l4 0.60 1.00 r0.2 v2 0 8 package weight gr. 0.29
package and packing information vnd10n06 / vnd10n06-1 20/25 5.3 ipak mechanical data figure 29. ipak mechanical data and package outline table 11. ipak mechanical data symbol millimeters min. typ. max. a2.2 2.4 a1 0.9 1.1 a3 0.7 1.3 b 0.64 0.9 b2 5.2 5.4 b3 0.85 b5 0.3 b6 0.95 c 0.45 0.6 c2 0.48 0.6 d6 6.2 e6.4 6.6 g4.4 4.6 h 15.9 16.3 l9 9.4 l1 0.8 1.2 l2 0.8 1
vnd10n06 / vnd10n06-1 package and packing information 21/25 5.4 dpak packing information the devices can be packed in tube or tape and reel shipments (see the device summary on page 1 ). figure 30. dpak footprint figure 31. dpak tube shipment (no suffix) a c b all dimensions are in mm. base q.ty 75 bulk q.ty 3000 tube length ( 0.5) 532 a 6 b 21.3 c ( 0.1) 0.6
package and packing information vnd10n06 / vnd10n06-1 22/25 figure 32. dpak tape and reel shipment (suffix ?tr?) tape dimensions according to electronic industries association (eia) standard 481 rev. a, feb 1986 all dimensions are in mm. tape width w 16 tape hole spacing p0 ( 0.1) 4 component spacing p 8 hole diameter d ( 0.1/-0) 1.5 hole diameter d1 (min) 1.5 hole position f ( 0.05) 7.5 compartment depth k (max) 6.5 hole spacing p1 ( 0.1) 2 top cover tape end start no components no components components 500mm min 500mm min empty components pockets saled with cover tape. user direction of feed reel dimensions base q.ty 2500 bulk q.ty 2500 a (max) 330 b (min) 1.5 c ( 0.2) 13 f 20.2 g (+ 2 / -0) 16.4 n (min) 60 t (max) 22.4
vnd10n06 / vnd10n06-1 package and packing information 23/25 5.5 ipak packing information figure 33. ipak tube shipment (no suffix) all dimensions are in mm. base q.ty 75 bulk q.ty 3000 tube length ( 0.5) 532 a 6 b 21.3 c ( 0.1) 0.6
revision history vnd10n06 / vnd10n06-1 24/25 6 revision history table 12. document revision history date revision changes oct-1997 1 initial release. 22-aug-2006 2 document restructured. 12-dec-2008 3 document restructur ed and reformatted. added ecopack ? packages information. 25-sep-2013 4 updated disclaimer.
docid4831 rev 4 25/25 vnd10n06 / vnd10n06-1 25 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. a ll st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industr y domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - italy - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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